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to + 85 °C
Input switching voltage
for threshold ON V20 = > VP-3 V V13 0 - 2.3 V
for threshold OFF V20 =
Input current
at ON condition V13 = 0 V -I13 -- 150 µA
at OFF condition V13 = 23 V -I13 -- 10 µA
Input voltage I13 = 0 V13 -- 4.4 V
Notes to the characteristics
1. Power gain conversion is equated by the following equation:
2
4 (VM (out) 10.7MHz) RS1
10 log----------------------------------------------------------- x ----------
-
2
RML
(EMF1 98 MHz)
2. Voltage gain is equated by the following equation:
V12
20 log ------------------
V16 15
August 1990 8
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
Fig.3 Keyed AGC output voltage V20 as a function Fig.4 Keyed AGC output voltage V20 as a function
of RMS input voltage V3. Measured in test of input voltage V14. Measured in test circuit
circuit Fig.1 at V14 = 0.7 V; I20 = 0. Fig.1 at V3 = 2 V; I20 = 0.
Fig.5 Keyed AGC output current I20 as a function Fig.6 Keyed AGC output voltage I20 as a function
of RMS input voltage V3. Measured in test of input voltage V14. Measured in test circuit
circuit Fig.1 at V14 = 0.7 V; V20 = 8.5 V. Fig.1 at V3 = 2 V; V20 = 8.5 V.
August 1990 9
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
Coil data
L1: TOKO MC-108, N1 = 5.5 turns, N2 = 1 turn
L2: see Fig.1
L3: see Fig.1
(1) Field strength indication of main IF amplifier.
Fig.7 TDA1574T application diagram.
August 1990 10
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
D E A
X
c
y HE v M A
Z
20 11
Q
A2
A
(A )
3
A1
pin 1 index
¸
Lp
L
1 10
detail X
e w M
bp
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1) (1) (1)
UNIT A1 A2 A3 bp c D E e HE L Lp Q v w yZ ¸
max.
0.30 2.45 0.49 0.32 13.0 7.6 10.65 1.1 1.1 0.9
mm 2.65
0.25 1.27 1.4 0.25 0.25 0.1
0.10 2.25 0.36 0.23 12.6 7.4 10.00 0.4 1.0 0.4
8o
0o
0.012 0.096 0.019 0.013 0.51 0.30 0.42 0.043 0.043 0.035
inches 0.10
0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.49 0.29 0.39 0.016 0.039 0.016
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT163-1 075E04 MS-013AC
95-01-24
August 1990 11
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
SOLDERING Wave soldering
Wave soldering techniques can be used for all SO
Introduction
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
" A double-wave (a turbulent wave with high upward
packages. Wave soldering is often preferred when
pressure followed by a smooth laminar wave) soldering
through-hole and surface mounted components are mixed
technique should be used.
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
" The longitudinal axis of the package footprint must be
printed-circuits with high population densities. In these
parallel to the solder flow.
situations reflow soldering is often used.
" The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
During placement and before soldering, the package must
our IC Package Databook (order code 9398 652 90011).
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
Reflow soldering
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
Reflow soldering requires solder paste (a suspension of
10 seconds, if cooled to less than 150 °C within
fine solder particles, flux and binding agent) to be applied
6 seconds. Typical dwell time is 4 seconds at 250 °C.
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
Repairing soldered joints
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
Fix the component by first soldering two diagonally-
215 to 250 °C.
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
Preheating is necessary to dry the paste and evaporate
time must be limited to 10 seconds at up to 300 °C. When
the binding agent. Preheating duration: 45 minutes at
using a dedicated tool, all other leads can be soldered in
45 °C.
one operation within 2 to 5 seconds between
270 and 320 °C.
August 1990 12
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1990 13
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